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Last modified by UT2UK on 2026/04/12 16:44
From version 10.1
edited by UT2UK
on 2026/04/12 16:43
Change comment: There is no comment for this version
To version 12.1
edited by UT2UK
on 2026/04/12 16:44
Change comment: There is no comment for this version

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... ... @@ -1,11 +4,10 @@
1 -Окей, окей, перевожу. Макросы не трогаю.
2 -Вот перевод:
3 -
4 4  == ==
5 5  
6 6  {{info}}
7 7  == **Can all variants of the original Ermak be upgraded to TT?** ==
5 +
8 8  ----
7 +
9 9  Yes, all variants. In some cases (the very first revisions with the old BPF block, FW adjustment is required).
10 10  {{/info}}
11 11  
... ... @@ -15,11 +15,11 @@
15 15  
16 16  Yes, all variants. In some cases (the very first revisions with the old BPF block, FW adjustment is required).
17 17  
18 -
19 19  {{info}}
20 -
21 21  == **What other hardware modules besides the DSP board will require upgrading?** ==
19 +
22 22  ----
21 +
23 23  * **DSP board 1GB DDR3 + 16GB** eMMC **rev 1.3**
24 24  * **Front panel board** with LED backlighting and dual encoders **rev 2.3**
25 25  * **Display board with installed TFT AMOLED 1920×1080** module **rev 1.2**
... ... @@ -33,34 +33,31 @@
33 33  * Additional gray button caps (16 pcs.)
34 34  * Headphone and microphone jacks (2 pcs.)
35 35  * LED lightpipes (2 pcs.)
36 -* **CPU heatsink** (1 pc.){{/info}}
35 +* **CPU heatsink** (1 pc.)
36 +{{/info}}
37 37  
38 -== (% class="box infomessage" %)
39 -**What other hardware modules besides the DSP board will require upgrading?**(%%) ==
38 +{{info}}
39 +**What other hardware modules besides the DSP board will require upgrading?** ==
40 40  
41 41  ----
42 42  
43 -* (% class="box infomessage" %)**DSP board 1GB DDR3 + 16GB** eMMC **rev 1.3**
44 -* (% class="box infomessage" %)**Front panel board** with LED backlighting and dual encoders **rev 2.3**
45 -* (% class="box infomessage" %)**Display board with installed TFT AMOLED 1920×1080** module **rev 1.2**
46 -* (% class="box infomessage" %)**PDB board** (power distribution board) without 6-pin LEMO connector (purchased separately). The 4-pin connector from the previous board can be used. **rev 1.2**
47 -* (% class="box infomessage" %)**New anodized front panel** with laser engraving
48 -* (% class="box infomessage" %)**New adapter cable** for connecting the PDB board (Ethernet + USB2)
49 -* (% class="box infomessage" %)**FPC** cables (2 pcs.)
50 -* (% class="box infomessage" %)**Knobs** for dual encoders
43 +* (% class="box infomessage" %)**DSP board 1GB DDR3 + 16GB** eMMC **rev 1.3**
44 +* (% class="box infomessage" %)**Front panel board** with LED backlighting and dual encoders **rev 2.3**
45 +* (% class="box infomessage" %)**Display board with installed TFT AMOLED 1920×1080** module **rev 1.2**
46 +* (% class="box infomessage" %)**PDB board** (power distribution board) without 6-pin LEMO connector (purchased separately). The 4-pin connector from the previous board can be used. **rev 1.2**
47 +* (% class="box infomessage" %)**New anodized front panel** with laser engraving
48 +* (% class="box infomessage" %)**New adapter cable** for connecting the PDB board (Ethernet + USB2)
49 +* (% class="box infomessage" %)**FPC** cables (2 pcs.)
50 +* (% class="box infomessage" %)**Knobs** for dual encoders
51 51  * (% class="box infomessage" %)Speaker acoustic enclosure (free of charge)
52 52  * (% class="box infomessage" %)Plastic standoffs (12 pcs.)
53 53  * (% class="box infomessage" %)Additional gray button caps (16 pcs.)
54 54  * (% class="box infomessage" %)Headphone and microphone jacks (2 pcs.)
55 55  * (% class="box infomessage" %)LED lightpipes (2 pcs.)
56 -* (% class="box infomessage" %)**CPU heatsink** (1 pc.)
56 +* (% class="box infomessage" %)**CPU heatsink** (1 pc.)
57 +{{/info}}
57 57  
58 58  
59 -
60 -(((
61 -
62 -)))
63 -
64 64  (% style="text-align: center;" %)
65 65  === **Front Panel with dual encoders and smart LEDs** ===
66 66  
... ... @@ -183,15 +183,19 @@
183 183  
184 184  {{error}}
185 185  == **Are there any nuances or important things to know before deciding to upgrade?** ==
182 +
186 186  ----
184 +
187 187  **Yes, there are several points to keep in mind:**
186 +
188 188  * The current unstable political and financial situation is affecting the components market and logistics.
189 189  * This has been especially pronounced in the memory market — due to sharp price spikes, the cost of memory components (DDR3 eMMC) has increased up to 5 times.
190 190  * As a result, the configuration had to be optimized: the eMMC capacity was reduced from 32 GB to 16 GB.
191 191  * Prices are currently fixed based on quotes already received from Chinese manufacturers, but they may change in the future.
192 192  * The first batch of DSP boards (the most expensive and critical component) is being assembled on a pre-order basis:
192 +
193 193  1. Once registration closes, the total number of participants is finalized.
194 194  1. An order is placed with the manufacturer for the remaining boards.
195 195  **Important**: Additional individual upgrades after the batch is formed are **not currently planned**, so it makes sense to decide in advance in order to be included in the current delivery.
196 196  {{/error}}
197 -
197 +)))