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Last modified by UT2UK on 2026/04/12 18:32
From version 11.1
edited by UT2UK
on 2026/04/12 16:44
Change comment: There is no comment for this version
To version 10.1
edited by UT2UK
on 2026/04/12 16:43
Change comment: There is no comment for this version

Summary

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Content
... ... @@ -5,9 +5,7 @@
5 5  
6 6  {{info}}
7 7  == **Can all variants of the original Ermak be upgraded to TT?** ==
8 -
9 9  ----
10 -
11 11  Yes, all variants. In some cases (the very first revisions with the old BPF block, FW adjustment is required).
12 12  {{/info}}
13 13  
... ... @@ -17,11 +17,11 @@
17 17  
18 18  Yes, all variants. In some cases (the very first revisions with the old BPF block, FW adjustment is required).
19 19  
18 +
20 20  {{info}}
21 -== **What other hardware modules besides the DSP board will require upgrading?** ==
22 22  
21 +== **What other hardware modules besides the DSP board will require upgrading?** ==
23 23  ----
24 -
25 25  * **DSP board 1GB DDR3 + 16GB** eMMC **rev 1.3**
26 26  * **Front panel board** with LED backlighting and dual encoders **rev 2.3**
27 27  * **Display board with installed TFT AMOLED 1920×1080** module **rev 1.2**
... ... @@ -35,31 +35,34 @@
35 35  * Additional gray button caps (16 pcs.)
36 36  * Headphone and microphone jacks (2 pcs.)
37 37  * LED lightpipes (2 pcs.)
38 -* **CPU heatsink** (1 pc.)
39 -{{/info}}
36 +* **CPU heatsink** (1 pc.){{/info}}
40 40  
41 -{{info}}
38 +== (% class="box infomessage" %)
42 42  **What other hardware modules besides the DSP board will require upgrading?**(%%) ==
43 43  
44 44  ----
45 45  
46 -* (% class="box infomessage" %)**DSP board 1GB DDR3 + 16GB** eMMC **rev 1.3**
47 -* (% class="box infomessage" %)**Front panel board** with LED backlighting and dual encoders **rev 2.3**
48 -* (% class="box infomessage" %)**Display board with installed TFT AMOLED 1920×1080** module **rev 1.2**
49 -* (% class="box infomessage" %)**PDB board** (power distribution board) without 6-pin LEMO connector (purchased separately). The 4-pin connector from the previous board can be used. **rev 1.2**
50 -* (% class="box infomessage" %)**New anodized front panel** with laser engraving
51 -* (% class="box infomessage" %)**New adapter cable** for connecting the PDB board (Ethernet + USB2)
52 -* (% class="box infomessage" %)**FPC** cables (2 pcs.)
53 -* (% class="box infomessage" %)**Knobs** for dual encoders
43 +* (% class="box infomessage" %)**DSP board 1GB DDR3 + 16GB** eMMC **rev 1.3**
44 +* (% class="box infomessage" %)**Front panel board** with LED backlighting and dual encoders **rev 2.3**
45 +* (% class="box infomessage" %)**Display board with installed TFT AMOLED 1920×1080** module **rev 1.2**
46 +* (% class="box infomessage" %)**PDB board** (power distribution board) without 6-pin LEMO connector (purchased separately). The 4-pin connector from the previous board can be used. **rev 1.2**
47 +* (% class="box infomessage" %)**New anodized front panel** with laser engraving
48 +* (% class="box infomessage" %)**New adapter cable** for connecting the PDB board (Ethernet + USB2)
49 +* (% class="box infomessage" %)**FPC** cables (2 pcs.)
50 +* (% class="box infomessage" %)**Knobs** for dual encoders
54 54  * (% class="box infomessage" %)Speaker acoustic enclosure (free of charge)
55 55  * (% class="box infomessage" %)Plastic standoffs (12 pcs.)
56 56  * (% class="box infomessage" %)Additional gray button caps (16 pcs.)
57 57  * (% class="box infomessage" %)Headphone and microphone jacks (2 pcs.)
58 58  * (% class="box infomessage" %)LED lightpipes (2 pcs.)
59 -* (% class="box infomessage" %)**CPU heatsink** (1 pc.)
60 -{{/info}}
56 +* (% class="box infomessage" %)**CPU heatsink** (1 pc.)
61 61  
62 62  
59 +
60 +(((
61 +
62 +)))
63 +
63 63  (% style="text-align: center;" %)
64 64  === **Front Panel with dual encoders and smart LEDs** ===
65 65  
... ... @@ -182,19 +182,15 @@
182 182  
183 183  {{error}}
184 184  == **Are there any nuances or important things to know before deciding to upgrade?** ==
185 -
186 186  ----
187 -
188 188  **Yes, there are several points to keep in mind:**
189 -
190 190  * The current unstable political and financial situation is affecting the components market and logistics.
191 191  * This has been especially pronounced in the memory market — due to sharp price spikes, the cost of memory components (DDR3 eMMC) has increased up to 5 times.
192 192  * As a result, the configuration had to be optimized: the eMMC capacity was reduced from 32 GB to 16 GB.
193 193  * Prices are currently fixed based on quotes already received from Chinese manufacturers, but they may change in the future.
194 194  * The first batch of DSP boards (the most expensive and critical component) is being assembled on a pre-order basis:
195 -
196 196  1. Once registration closes, the total number of participants is finalized.
197 197  1. An order is placed with the manufacturer for the remaining boards.
198 198  **Important**: Additional individual upgrades after the batch is formed are **not currently planned**, so it makes sense to decide in advance in order to be included in the current delivery.
199 199  {{/error}}
200 -)))
197 +