Changes for page Обновление ERMAK до версии ERMAK-TT
Last modified by UT2UK on 2026/04/12 18:32
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... ... @@ -1,20 +1,25 @@ 1 +Окей, окей, перевожу. Макросы не трогаю. 2 +Вот перевод: 3 + 1 1 == == 2 2 3 3 {{info}} 4 4 == **Can all variants of the original Ermak be upgraded to TT?** == 5 - 6 6 ---- 7 - 8 8 Yes, all variants. In some cases (the very first revisions with the old BPF block, FW adjustment is required). 9 9 {{/info}} 10 10 12 +== **Can all variants of the original Ermak be upgraded to TT?** == 11 11 14 +---- 12 12 16 +Yes, all variants. In some cases (the very first revisions with the old BPF block, FW adjustment is required). 17 + 18 + 13 13 {{info}} 14 -== **What other hardware modules besides the DSP board will require upgrading?** == 15 15 21 +== **What other hardware modules besides the DSP board will require upgrading?** == 16 16 ---- 17 - 18 18 * **DSP board 1GB DDR3 + 16GB** eMMC **rev 1.3** 19 19 * **Front panel board** with LED backlighting and dual encoders **rev 2.3** 20 20 * **Display board with installed TFT AMOLED 1920×1080** module **rev 1.2** ... ... @@ -28,31 +28,34 @@ 28 28 * Additional gray button caps (16 pcs.) 29 29 * Headphone and microphone jacks (2 pcs.) 30 30 * LED lightpipes (2 pcs.) 31 -* **CPU heatsink** (1 pc.) 32 -{{/info}} 36 +* **CPU heatsink** (1 pc.){{/info}} 33 33 34 - {{info}}35 -**What other hardware modules besides the DSP board will require upgrading?** == 38 +== (% class="box infomessage" %) 39 +**What other hardware modules besides the DSP board will require upgrading?**(%%) == 36 36 37 37 ---- 38 38 39 -* (% class="box infomessage" %)**DSP board 1GB DDR3 + 16GB** eMMC **rev 1.3**40 -* (% class="box infomessage" %)**Front panel board** with LED backlighting and dual encoders **rev 2.3**41 -* (% class="box infomessage" %)**Display board with installed TFT AMOLED 1920×1080** module **rev 1.2**42 -* (% class="box infomessage" %)**PDB board** (power distribution board) without 6-pin LEMO connector (purchased separately). The 4-pin connector from the previous board can be used. **rev 1.2**43 -* (% class="box infomessage" %)**New anodized front panel** with laser engraving44 -* (% class="box infomessage" %)**New adapter cable** for connecting the PDB board (Ethernet + USB2)45 -* (% class="box infomessage" %)**FPC** cables (2 pcs.)46 -* (% class="box infomessage" %)**Knobs** for dual encoders43 +* (% class="box infomessage" %)**DSP board 1GB DDR3 + 16GB** eMMC **rev 1.3** 44 +* (% class="box infomessage" %)**Front panel board** with LED backlighting and dual encoders **rev 2.3** 45 +* (% class="box infomessage" %)**Display board with installed TFT AMOLED 1920×1080** module **rev 1.2** 46 +* (% class="box infomessage" %)**PDB board** (power distribution board) without 6-pin LEMO connector (purchased separately). The 4-pin connector from the previous board can be used. **rev 1.2** 47 +* (% class="box infomessage" %)**New anodized front panel** with laser engraving 48 +* (% class="box infomessage" %)**New adapter cable** for connecting the PDB board (Ethernet + USB2) 49 +* (% class="box infomessage" %)**FPC** cables (2 pcs.) 50 +* (% class="box infomessage" %)**Knobs** for dual encoders 47 47 * (% class="box infomessage" %)Speaker acoustic enclosure (free of charge) 48 48 * (% class="box infomessage" %)Plastic standoffs (12 pcs.) 49 49 * (% class="box infomessage" %)Additional gray button caps (16 pcs.) 50 50 * (% class="box infomessage" %)Headphone and microphone jacks (2 pcs.) 51 51 * (% class="box infomessage" %)LED lightpipes (2 pcs.) 52 -* (% class="box infomessage" %)**CPU heatsink** (1 pc.) 53 -{{/info}} 56 +* (% class="box infomessage" %)**CPU heatsink** (1 pc.) 54 54 55 55 59 + 60 +((( 61 + 62 +))) 63 + 56 56 (% style="text-align: center;" %) 57 57 === **Front Panel with dual encoders and smart LEDs** === 58 58 ... ... @@ -175,19 +175,15 @@ 175 175 176 176 {{error}} 177 177 == **Are there any nuances or important things to know before deciding to upgrade?** == 178 - 179 179 ---- 180 - 181 181 **Yes, there are several points to keep in mind:** 182 - 183 183 * The current unstable political and financial situation is affecting the components market and logistics. 184 184 * This has been especially pronounced in the memory market — due to sharp price spikes, the cost of memory components (DDR3 eMMC) has increased up to 5 times. 185 185 * As a result, the configuration had to be optimized: the eMMC capacity was reduced from 32 GB to 16 GB. 186 186 * Prices are currently fixed based on quotes already received from Chinese manufacturers, but they may change in the future. 187 187 * The first batch of DSP boards (the most expensive and critical component) is being assembled on a pre-order basis: 188 - 189 189 1. Once registration closes, the total number of participants is finalized. 190 190 1. An order is placed with the manufacturer for the remaining boards. 191 191 **Important**: Additional individual upgrades after the batch is formed are **not currently planned**, so it makes sense to decide in advance in order to be included in the current delivery. 192 192 {{/error}} 193 - )))197 +