Last modified by UT2UK on 2026/04/12 18:32

From version 13.1
edited by UT2UK
on 2026/04/12 18:32
Change comment: There is no comment for this version
To version 10.1
edited by UT2UK
on 2026/04/12 16:43
Change comment: There is no comment for this version

Summary

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1 +Окей, окей, перевожу. Макросы не трогаю.
2 +Вот перевод:
3 +
1 1  == ==
2 2  
3 3  {{info}}
4 4  == **Can all variants of the original Ermak be upgraded to TT?** ==
5 -
6 6  ----
7 -
8 8  Yes, all variants. In some cases (the very first revisions with the old BPF block, FW adjustment is required).
9 9  {{/info}}
10 10  
12 +== **Can all variants of the original Ermak be upgraded to TT?** ==
11 11  
14 +----
12 12  
16 +Yes, all variants. In some cases (the very first revisions with the old BPF block, FW adjustment is required).
17 +
18 +
13 13  {{info}}
14 -== **What other hardware modules besides the DSP board will require upgrading?** ==
15 15  
21 +== **What other hardware modules besides the DSP board will require upgrading?** ==
16 16  ----
17 -
18 18  * **DSP board 1GB DDR3 + 16GB** eMMC **rev 1.3**
19 19  * **Front panel board** with LED backlighting and dual encoders **rev 2.3**
20 20  * **Display board with installed TFT AMOLED 1920×1080** module **rev 1.2**
... ... @@ -28,31 +28,34 @@
28 28  * Additional gray button caps (16 pcs.)
29 29  * Headphone and microphone jacks (2 pcs.)
30 30  * LED lightpipes (2 pcs.)
31 -* **CPU heatsink** (1 pc.)
32 -{{/info}}
36 +* **CPU heatsink** (1 pc.){{/info}}
33 33  
34 -{{info}}
35 -**What other hardware modules besides the DSP board will require upgrading?** ==
38 +== (% class="box infomessage" %)
39 +**What other hardware modules besides the DSP board will require upgrading?**(%%) ==
36 36  
37 37  ----
38 38  
39 -* (% class="box infomessage" %)**DSP board 1GB DDR3 + 16GB** eMMC **rev 1.3**
40 -* (% class="box infomessage" %)**Front panel board** with LED backlighting and dual encoders **rev 2.3**
41 -* (% class="box infomessage" %)**Display board with installed TFT AMOLED 1920×1080** module **rev 1.2**
42 -* (% class="box infomessage" %)**PDB board** (power distribution board) without 6-pin LEMO connector (purchased separately). The 4-pin connector from the previous board can be used. **rev 1.2**
43 -* (% class="box infomessage" %)**New anodized front panel** with laser engraving
44 -* (% class="box infomessage" %)**New adapter cable** for connecting the PDB board (Ethernet + USB2)
45 -* (% class="box infomessage" %)**FPC** cables (2 pcs.)
46 -* (% class="box infomessage" %)**Knobs** for dual encoders
43 +* (% class="box infomessage" %)**DSP board 1GB DDR3 + 16GB** eMMC **rev 1.3**
44 +* (% class="box infomessage" %)**Front panel board** with LED backlighting and dual encoders **rev 2.3**
45 +* (% class="box infomessage" %)**Display board with installed TFT AMOLED 1920×1080** module **rev 1.2**
46 +* (% class="box infomessage" %)**PDB board** (power distribution board) without 6-pin LEMO connector (purchased separately). The 4-pin connector from the previous board can be used. **rev 1.2**
47 +* (% class="box infomessage" %)**New anodized front panel** with laser engraving
48 +* (% class="box infomessage" %)**New adapter cable** for connecting the PDB board (Ethernet + USB2)
49 +* (% class="box infomessage" %)**FPC** cables (2 pcs.)
50 +* (% class="box infomessage" %)**Knobs** for dual encoders
47 47  * (% class="box infomessage" %)Speaker acoustic enclosure (free of charge)
48 48  * (% class="box infomessage" %)Plastic standoffs (12 pcs.)
49 49  * (% class="box infomessage" %)Additional gray button caps (16 pcs.)
50 50  * (% class="box infomessage" %)Headphone and microphone jacks (2 pcs.)
51 51  * (% class="box infomessage" %)LED lightpipes (2 pcs.)
52 -* (% class="box infomessage" %)**CPU heatsink** (1 pc.)
53 -{{/info}}
56 +* (% class="box infomessage" %)**CPU heatsink** (1 pc.)
54 54  
55 55  
59 +
60 +(((
61 +
62 +)))
63 +
56 56  (% style="text-align: center;" %)
57 57  === **Front Panel with dual encoders and smart LEDs** ===
58 58  
... ... @@ -175,19 +175,15 @@
175 175  
176 176  {{error}}
177 177  == **Are there any nuances or important things to know before deciding to upgrade?** ==
178 -
179 179  ----
180 -
181 181  **Yes, there are several points to keep in mind:**
182 -
183 183  * The current unstable political and financial situation is affecting the components market and logistics.
184 184  * This has been especially pronounced in the memory market — due to sharp price spikes, the cost of memory components (DDR3 eMMC) has increased up to 5 times.
185 185  * As a result, the configuration had to be optimized: the eMMC capacity was reduced from 32 GB to 16 GB.
186 186  * Prices are currently fixed based on quotes already received from Chinese manufacturers, but they may change in the future.
187 187  * The first batch of DSP boards (the most expensive and critical component) is being assembled on a pre-order basis:
188 -
189 189  1. Once registration closes, the total number of participants is finalized.
190 190  1. An order is placed with the manufacturer for the remaining boards.
191 191  **Important**: Additional individual upgrades after the batch is formed are **not currently planned**, so it makes sense to decide in advance in order to be included in the current delivery.
192 192  {{/error}}
193 -)))
197 +