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Last modified by UT2UK on 2026/04/12 18:32
From version 5.1
edited by UT2UK
on 2026/04/12 16:35
Change comment: There is no comment for this version
To version 10.1
edited by UT2UK
on 2026/04/12 16:43
Change comment: There is no comment for this version

Summary

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1 +Окей, окей, перевожу. Макросы не трогаю.
2 +Вот перевод:
3 +
1 1  == ==
2 2  
3 3  {{info}}
4 4  == **Can all variants of the original Ermak be upgraded to TT?** ==
5 -
6 6  ----
7 -
8 8  Yes, all variants. In some cases (the very first revisions with the old BPF block, FW adjustment is required).
9 9  {{/info}}
10 10  
... ... @@ -14,14 +14,12 @@
14 14  
15 15  Yes, all variants. In some cases (the very first revisions with the old BPF block, FW adjustment is required).
16 16  
18 +
17 17  {{info}}
18 18  
19 -{{/info}}
20 20  == **What other hardware modules besides the DSP board will require upgrading?** ==
21 -
22 22  ----
23 -
24 -* **DSP board 1GB DDR3 + 16GB** EMMc **rev 1.3**
23 +* **DSP board 1GB DDR3 + 16GB** eMMC **rev 1.3**
25 25  * **Front panel board** with LED backlighting and dual encoders **rev 2.3**
26 26  * **Display board with installed TFT AMOLED 1920×1080** module **rev 1.2**
27 27  * **PDB board** (power distribution board) without 6-pin LEMO connector (purchased separately). The 4-pin connector from the previous board can be used. **rev 1.2**
... ... @@ -34,27 +34,27 @@
34 34  * Additional gray button caps (16 pcs.)
35 35  * Headphone and microphone jacks (2 pcs.)
36 36  * LED lightpipes (2 pcs.)
37 -* **CPU heatsink** (1 pc.)
38 -{{/info}}
36 +* **CPU heatsink** (1 pc.){{/info}}
39 39  
40 -== (% class="box infomessage" %)**What other hardware modules besides the DSP board will require upgrading?**(%%) ==
38 +== (% class="box infomessage" %)
39 +**What other hardware modules besides the DSP board will require upgrading?**(%%) ==
41 41  
42 42  ----
43 43  
44 -* (% class="box infomessage" %)**DSP board 1GB DDR3 + 16GB** EMMc **rev 1.3**
45 -* (% class="box infomessage" %)**Front panel board** with LED backlighting and dual encoders **rev 2.3**
46 -* (% class="box infomessage" %)**Display board with installed TFT AMOLED 1920×1080** module **rev 1.2**
47 -* (% class="box infomessage" %)**PDB board** (power distribution board) without 6-pin LEMO connector (purchased separately). The 4-pin connector from the previous board can be used. **rev 1.2**
48 -* (% class="box infomessage" %)**New anodized front panel** with laser engraving
49 -* (% class="box infomessage" %)**New adapter cable** for connecting the PDB board (Ethernet + USB2)
50 -* (% class="box infomessage" %)**FPC** cables (2 pcs.)
51 -* (% class="box infomessage" %)**Knobs** for dual encoders
43 +* (% class="box infomessage" %)**DSP board 1GB DDR3 + 16GB** eMMC **rev 1.3**
44 +* (% class="box infomessage" %)**Front panel board** with LED backlighting and dual encoders **rev 2.3**
45 +* (% class="box infomessage" %)**Display board with installed TFT AMOLED 1920×1080** module **rev 1.2**
46 +* (% class="box infomessage" %)**PDB board** (power distribution board) without 6-pin LEMO connector (purchased separately). The 4-pin connector from the previous board can be used. **rev 1.2**
47 +* (% class="box infomessage" %)**New anodized front panel** with laser engraving
48 +* (% class="box infomessage" %)**New adapter cable** for connecting the PDB board (Ethernet + USB2)
49 +* (% class="box infomessage" %)**FPC** cables (2 pcs.)
50 +* (% class="box infomessage" %)**Knobs** for dual encoders
52 52  * (% class="box infomessage" %)Speaker acoustic enclosure (free of charge)
53 53  * (% class="box infomessage" %)Plastic standoffs (12 pcs.)
54 54  * (% class="box infomessage" %)Additional gray button caps (16 pcs.)
55 55  * (% class="box infomessage" %)Headphone and microphone jacks (2 pcs.)
56 56  * (% class="box infomessage" %)LED lightpipes (2 pcs.)
57 -* (% class="box infomessage" %)**CPU heatsink** (1 pc.)
56 +* (% class="box infomessage" %)**CPU heatsink** (1 pc.)
58 58  
59 59  
60 60  
... ... @@ -107,7 +107,7 @@
107 107  [[image:1775928301785-613.png||data-xwiki-image-style-alignment="center" data-xwiki-image-style-border="true" height="833" width="624"]][[image:1775928520924-295.png||data-xwiki-image-style-alignment="center" data-xwiki-image-style-border="true" height="467" width="623"]]
108 108  
109 109  (% style="text-align: center;" %)
110 -=== **Knobs for dual encoders (2 pcs)** ===
109 +=== **Knobs for dual encoders (2 pcs.)** ===
111 111  
112 112  [[image:1775928649337-110.png||data-xwiki-image-style-alignment="center" data-xwiki-image-style-border="true" height="817" width="613"]]
113 113  
... ... @@ -115,7 +115,7 @@
115 115  === ===
116 116  
117 117  (% style="text-align: center;" %)
118 -=== **Additional button caps, plastic standoffs (12 pcs) and LED lightpipes** ===
117 +=== **Additional button caps, plastic standoffs (12 pcs.) and LED lightpipes** ===
119 119  
120 120  [[image:1775928936867-245.png||data-xwiki-image-style-alignment="center" height="584" width="594"]]
121 121  
... ... @@ -139,7 +139,7 @@
139 139  * **Display board (AMOLED TFT module)** — $70
140 140  * **PDB board** — $30
141 141  * **Adapter cable for PDB connection (Ethernet + USB 2.0)** — $4
142 -* **Anodized front panel (new)** — $40
141 +* **New anodized front panel** — $40
143 143  * **Mounting hardware, knobs, button caps, heatsink, headphone jacks** — $20
144 144  {{/success}}
145 145  
... ... @@ -184,19 +184,15 @@
184 184  
185 185  {{error}}
186 186  == **Are there any nuances or important things to know before deciding to upgrade?** ==
187 -
188 188  ----
189 -
190 190  **Yes, there are several points to keep in mind:**
191 -
192 192  * The current unstable political and financial situation is affecting the components market and logistics.
193 193  * This has been especially pronounced in the memory market — due to sharp price spikes, the cost of memory components (DDR3 eMMC) has increased up to 5 times.
194 194  * As a result, the configuration had to be optimized: the eMMC capacity was reduced from 32 GB to 16 GB.
195 195  * Prices are currently fixed based on quotes already received from Chinese manufacturers, but they may change in the future.
196 196  * The first batch of DSP boards (the most expensive and critical component) is being assembled on a pre-order basis:
197 -
198 198  1. Once registration closes, the total number of participants is finalized.
199 199  1. An order is placed with the manufacturer for the remaining boards.
200 200  **Important**: Additional individual upgrades after the batch is formed are **not currently planned**, so it makes sense to decide in advance in order to be included in the current delivery.
201 201  {{/error}}
202 -)))
197 +